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- 4th International SAXS/GISAXS Workshop (PDF)
Sep 09-11, Leoben, Austria - Navigated Atomic Force Microscopy - N8 NEOS
Sep 15, Free Webinar - 17th Bruker Users‘ Group Meetings 2010 - Single Crystal X-ray Diffraction
Sep 19-22, Karlsruhe, Germany - Good Diffraction Practice III - Powder XRD Instrumentation and Data Quality
Sep 30, Free Webinar - COM2010 - Conference of Metallurgists
Oct 03-06, Vancouver, British Columbia, Canada
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X-ray Metrology
- X-ray Metrology with the D8 FABLINE
The semiconductor industry is continuously challenged to produce smaller devices and purer compounds, all under a higher throughput. Bruker AXS offers world-leading technology for fast and precise measurements to monitor the process.
For any application, whether it is thin film analysis, checking the composition of solder bumps or monitoring contamination, Bruker AXS offers optimised solutions for fully automated FEOL, BEOL tools and state of the art lab R&D systems.
- Wafers from 6“ to 300 mm
- Horizontal sample mount for safe wafer handling and high sample throughput
- SECS/GEM interface for straightforward fab integration
- Automatic pattern recognition for precise micro analysis
- Integrated single or dual FOUP port interface for wafer loading